Engineering Technology Associates, Inc. (ETA) announced the release of DYNAFORM Version 5.9. In the new version, a brand new module, incorporating optimization, has been unveiled. The Optimization Platform (OP) makes DYNAFORM the most complete and powerful solution on the market for die system simulation and optimization.
ETA has embedded Red Cedar’s proprietary optimization technology, SHERPA, into the OP module. The module is focused on supporting optimization of drawbead forces along with binder pressure, lubrication, gage, and material.
Using the newest optimization technology, the OP module reduces product development time and cost for manufacturing by reducing incidents of wrinkling, thinning and tearing with limited effort. The OP guided user interface makes optimization viable for a larger set of users, since special optimization expertise is not required. Additionally, the latest computing platforms combined with an efficient solver eliminate demanding computing requirements. The solver is an incremental solution (INCSolver) that delivers exceptional speed, taking advantage of Shared Memory Processing (SMP) computing technology on multiple core machines running Windows 7 and beyond.
The OP module will use the same common interface as the other four modules of DYNAFORM that include Blank Size Engineering (BSE), Die Face Engineering (DFE), Formability Simulation (FS), and Die System Analysis (DSA). Each of the four previously available modules has also been enhanced in the Version 5.9 software release. |
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